Intel has declared its first hybrid CPUs that merge high-power and low-power architectures, generally utilized in independent Core and Atom product lines.
The brand new ‘Lakefield’ CPU range models are particularly targeted for ultra-portable laptops and latest form features like dual-screen and folding-screen models. Two CPUs have been advertised, the modern Intel Core i5-L16G7 and Core i3-L13G4, apiece with one high-power core, and four high-efficiency cores. They will initially be presented in Lenovo’s ThinkPad X1 Fold and Samsung Galaxy Book S. This is also the prime customer application of Intel’s Feveros 3D stacking CPU construction technology.
Intel had stated in its declaration that the amalgamation of these latest advancements permits for a CPU that is physically 56 percent smaller than the present ones, leading to tinier motherboards, increased flexibility in PC design, and also smaller and less heavy devices. The chips use up as tiny as 2.5mW of power in standby, which Intel stated is a 91 percent decline in comparison to an 8th Gen Core i7 Y-series mobile CPU.
The Core i5-L16G7 and Core i3-L13G4 both will have a Sunny Cove core and four Tremont cores. Intel initially released Sunny Cove in late 2018, and it is the same architecture that gives rise to their existing 10th Gen 10nm ‘Ice Lake’ CPUs for laptops. Tremont is triumphs a 10nm architecture and triumphs Intel’s previous low-power designs discovered in Atom, Celeron, and Pentium Silver CPUs in the desktop, server, and embedded spaces.
Their brand new hybrid CPUs will constitute to be Intel’s 10th Gen Core series adjacent to the current parts based on the Ice Lake and Comet Lake architectures. They will be distinguished by their numbering scheme, which displays the relative power of every single CPU and its incorporated graphics capabilities, reflecting the present Ice Lake laptop family. They will be formally outlined as “Intel Core processors with Intel Hybrid Technology.”
Both these latest models have 7W TDP ratings and 4MB of cache memory. The Core i5-L16G7 has a base speed of 1.4GHz across all cores with single-core (the Sunny Cove core only) and all-core boost speeds of 3GHz and 1.8GHz individually. It elements 64 Gen11 graphics execution units. The Core i3-L13G4 runs at 800MHz with an enhanced speed of 2.8GHz and 1.3GHz respectively, and has 48 graphics execution pieces.
Intel assures a giant leap in graphics performance for the 7W TDP CPU section. The Lakefield chips are also exclaimed to be the first with dual graphics pipelines, particularly optimised for multi-screen appliances. On-chip AI inference expansions are also backed, similar to Ice Lake on the platform level, there is assistance for Gigabit-class Wi-Fi 6 and LTE solutions and LPDDR4X-4267 RAM.
The Foveros 3D stacking method enabled Intel to create this modular design, leveraging blocks of technology with different architectures. Lakefield merges 10nm cores with higher IO components based on older operations, very similar to AMD’s existing chipset strategy with its Zen 2 architecture. This could assist Intel in dealing with its in-progress 10nm manufacturing issues.
The Lakefield chips are 12mm square and 1mm thick. The concept of merging varied high-power and low-energy CPU cores is usual in the ARM-based mobile CPU space, with the deal generally termed “big. Little”. Intel states that the Windows 10 scheduler is completely competent in allocating tasks to a suitable core using “hardware-guided” planning.